Research article Topical Sections

Analysis of temperature dependent power supply voltage drop in graphene nanoribbon and Cu based power interconnects

  • Received: 25 September 2016 Accepted: 31 October 2016 Published: 10 November 2016
  • In this paper, we propose a temperature dependent resistive model of multi layered graphene nanoribbon (MLGNR) and Cu based power interconnects. Using the proposed model, power supply voltage drop (IR-drop) analysis for 16 nm technology node is performed. The novelty in our work is that this is the first time a temperature dependent IR-Drop model for MLGNR and Cu interconnects is proposed. For a temperature range from 150 K to 450 K, the variation of resistance of MLGNR interconnect is ~2–5× times lesser than that of traditional copper based power interconnects. Our analysis shows that MLGNR based power interconnects can achieve ~1.5–3.5× reduction in IR-drop and ~1.5–3× reduction in propagation delay as compared with copper based interconnects for local, intermediate and global interconnects.

    Citation: Sandip Bhattacharya, Debaprasad Das, Hafizur Rahaman. Analysis of temperature dependent power supply voltage drop in graphene nanoribbon and Cu based power interconnects[J]. AIMS Materials Science, 2016, 3(4): 1493-1506. doi: 10.3934/matersci.2016.4.1493

    Related Papers:

  • In this paper, we propose a temperature dependent resistive model of multi layered graphene nanoribbon (MLGNR) and Cu based power interconnects. Using the proposed model, power supply voltage drop (IR-drop) analysis for 16 nm technology node is performed. The novelty in our work is that this is the first time a temperature dependent IR-Drop model for MLGNR and Cu interconnects is proposed. For a temperature range from 150 K to 450 K, the variation of resistance of MLGNR interconnect is ~2–5× times lesser than that of traditional copper based power interconnects. Our analysis shows that MLGNR based power interconnects can achieve ~1.5–3.5× reduction in IR-drop and ~1.5–3× reduction in propagation delay as compared with copper based interconnects for local, intermediate and global interconnects.


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