Effect of alumina nanoparticles on the microstructure, mechanical, and thermal properties of penta bismuth-tin-based solder alloys

Abbas Al-Bawee; Feryal Dawood; Ahmed Alrubaiy; Abbas Al-Bawee; Feryal Dawood; Ahmed Alrubaiy

doi:10.3934/matersci.2026004

AIMS Materials Science

2026, Volume 13, Issue 1: 63-79. doi: 10.3934/matersci.2026004

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Research article

Effect of alumina nanoparticles on the microstructure, mechanical, and thermal properties of penta bismuth-tin-based solder alloys

1.
University of Diyala, College of Engineering, Baquba, Diyala, Iraq
2.
University of Diyala, College of Basic Education, Baquba, Diyala, Iraq

Received: 15 October 2025 Revised: 14 December 2025 Accepted: 18 December 2025 Published: 12 January 2026

This study systematically investigated the thermal, mechanical, and structural properties of a bismuth-based (Bi-Pb-Sn-Cr-In) pentacrystalline structure solder matrix doped with nano-alumina powders to evaluate its characteristics at various nano-alumina loadings (0.5–1.5 wt%). Four well-designed nano-Al₂O₃ production alloys, differing only in nano-Al₂O₃ content, were synthesized and then investigated through X-ray diffraction, thermal/electrical transport tests, and elastic-hardness mapping methods to evaluate the effectiveness of the reinforcement. The results indicate that the presence of Al₂O₃ optimized the crystalline lattice of the alloy and effectively enhanced its mechanical properties, especially nano-Al₂O₃ at 1 wt%, which acted as a structural refiner, leading to the finest crystal domains and to the maximum Vickers microhardness value of 19.05 kg/mm². Thermal management of Al₂O₃ agglomerate improves thermal stability and mechanical strength by increasing the alloy's melting temperature and pasty range. The specified 1 wt% nano-Al₂O₃ reinforcement loading provides enhanced mechanical robustness, thermal endurance, and electrical conductivity, with outcomes such as extended operational lifespans, lower failure rates, and long-term reliability in electronic packaging systems.
- mechanical-thermal-electrical synergy,
- nano-alumina reinforced Bi-Sn solder,
- thermal properties,
- lead-free penta-alloy system,
- conductivity,
- melting point
Citation: Abbas Al-Bawee, Feryal Dawood, Ahmed Alrubaiy. Effect of alumina nanoparticles on the microstructure, mechanical, and thermal properties of penta bismuth-tin-based solder alloys[J]. AIMS Materials Science, 2026, 13(1): 63-79. doi: 10.3934/matersci.2026004

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Abstract

This study systematically investigated the thermal, mechanical, and structural properties of a bismuth-based (Bi-Pb-Sn-Cr-In) pentacrystalline structure solder matrix doped with nano-alumina powders to evaluate its characteristics at various nano-alumina loadings (0.5–1.5 wt%). Four well-designed nano-Al₂O₃ production alloys, differing only in nano-Al₂O₃ content, were synthesized and then investigated through X-ray diffraction, thermal/electrical transport tests, and elastic-hardness mapping methods to evaluate the effectiveness of the reinforcement. The results indicate that the presence of Al₂O₃ optimized the crystalline lattice of the alloy and effectively enhanced its mechanical properties, especially nano-Al₂O₃ at 1 wt%, which acted as a structural refiner, leading to the finest crystal domains and to the maximum Vickers microhardness value of 19.05 kg/mm². Thermal management of Al₂O₃ agglomerate improves thermal stability and mechanical strength by increasing the alloy's melting temperature and pasty range. The specified 1 wt% nano-Al₂O₃ reinforcement loading provides enhanced mechanical robustness, thermal endurance, and electrical conductivity, with outcomes such as extended operational lifespans, lower failure rates, and long-term reliability in electronic packaging systems.

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