-
AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635.
Research article Topical Section
-
Export file:
Format
- RIS(for EndNote,Reference Manager,ProCite)
- BibTex
- Text
Content
- Citation Only
- Citation and Abstract
Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon
1 Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China
2 Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China
Received: , Accepted: , Published:
Topical Section: Materials Processing
Keywords: monocrystalline silicon; diamond turning; surface integrity; rake angle
Citation: Lu Liao, Guo Li, Junjie Zhang. Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon. AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635
References:
-
1. Goel S, Luo X, Comley P, et al. (2013) Brittle–ductile transition during diamond turning of single crystal silicon carbide. Int J Mach Tool Manu 65: 15–21.
-
2. Zhou M, Ngoi BKA, Zhong ZW, et al. (2001) Brittle-ductile transition in diamond cutting of silicon single crystals. Mater Manuf Process 16: 447–460.
-
3. Xiao G, To S, Zhang G (2015) Molecular dynamics modelling of brittle–ductile cutting mode transition: case study on silicon carbide. Int J Mach Tool Manu 88: 214–222.
- 4. Wang MH, Lu ZS (2008) Study on brittle-ductile transition mechanism of ultra-precision turning of single crystal silicon. Key Eng Mater 375: 11–16.
- 5. Mukaiyama K, Ozaki M, Wada T (2017) Study on ductile-brittle transition of single crystal silicon by a scratching test using a single diamond tool. 2017 8th International Conference on Mechanical and Aerospace Engineering (ICMAE), 40–44.
-
6. Xiao GB, To S, Jelenković EV (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Tech 225: 439–450.
-
7. To S, Wang H, Jelenković EV (2013) Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting. Int J Mach Tool Manu 74: 50–55.
-
8. Wang JS, Zhang XD, Fang FZ, et al. (2019) Diamond cutting of micro-structure array on brittle material assisted by multi-ion implantation. Int J Mach Tool Manu 137: 58–66.
-
9. Wang JS, Zhang XD, Fang FZ (2016) Molecular dynamics study on nanometric cutting of ion implanted silicon. Comp Mater Sci 117: 240–250.
-
10. Fang FZ, Chen YH, Zhang XD, et al. (2011) Nanometric cutting of single crystal silicon surfaces modified by ion implantation. CIRP Ann 60: 527–530.
-
11. Wang M, Wang W, Lu Z (2012) Anisotropy of machined surfaces involved in the ultra-precision turning of single-crystal silicon-a simulation and experimental study. Int J Adv Manuf Tech 60: 473–485.
-
12. Cheung CF, To S, Lee WB (2002) Anisotropy of surface roughness in diamond turning of brittle single crystals. Mater Manuf Process 17: 251–267.
- 13. Kobaru Y, Kondo E, Iwamoto R (2012) Ultra-precision cutting of single crystal silicon using diamond tool with large top corner radius. Key Eng Mater 523: 81–86.
-
14. Kobaru Y, Kondo E, Iwamoto R (2017) Precision cutting of single crystal silicon using CBN tool with large top corner radius. Int J Nanomanuf 13: 170–184.
-
15. Abdulkadir LN, Abou-El-Hossein K, Jumare AI, et al. (2018) Ultra-precision diamond turning of optical silicon-a review. Int J Adv Manuf Tech 96: 173–208.
- 16. Zhang JJ, Han L, Zhang JG, et al. (2019) Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon. Int J Adv Manuf Tech. Available from: https://doi.org/10.1007/s00170-019-03888-8.
Reader Comments
© 2019 the Author(s), licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution Licese (http://creativecommons.org/licenses/by/4.0)
Associated material
Metrics
Other articles by authors
Related pages
Tools
your name: * your email: *