Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon

Lu Liao; Guo Li; Junjie Zhang

doi:10.3934/matersci.2019.5.635

AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635. Research article Topical Section

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Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon

Lu Liao, Guo Li, Junjie Zhang

1 Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China
2 Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China

Received: , Accepted: , Published:

Topical Section: Materials Processing

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The machinability of brittle materials is strongly dependent on machining conditions. In the present work, we perform ultra-precision single point diamond turning experiments of monocrystalline Si(100) using diamond cutting tools. The machined surface quality is characterized by evaluating surface topography and surface integrity. Systematic investigation of cutting parameters dependence of machining results is performed by considering rake angle of cutting tool, depth of cut and spindle speed. Experimental results suggest an optimized combination of cutting parameters for the best surface quality of Si(100) by diamond turning.

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Keywords: monocrystalline silicon; diamond turning; surface integrity; rake angle

Citation: Lu Liao, Guo Li, Junjie Zhang. Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon. AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635

References:

1. Goel S, Luo X, Comley P, et al. (2013) Brittle–ductile transition during diamond turning of single crystal silicon carbide. Int J Mach Tool Manu 65: 15–21.
2. Zhou M, Ngoi BKA, Zhong ZW, et al. (2001) Brittle-ductile transition in diamond cutting of silicon single crystals. Mater Manuf Process 16: 447–460.
3. Xiao G, To S, Zhang G (2015) Molecular dynamics modelling of brittle–ductile cutting mode transition: case study on silicon carbide. Int J Mach Tool Manu 88: 214–222.
4. Wang MH, Lu ZS (2008) Study on brittle-ductile transition mechanism of ultra-precision turning of single crystal silicon. Key Eng Mater 375: 11–16.
5. Mukaiyama K, Ozaki M, Wada T (2017) Study on ductile-brittle transition of single crystal silicon by a scratching test using a single diamond tool. 2017 8th International Conference on Mechanical and Aerospace Engineering (ICMAE), 40–44.
6. Xiao GB, To S, Jelenković EV (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Tech 225: 439–450.
7. To S, Wang H, Jelenković EV (2013) Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting. Int J Mach Tool Manu 74: 50–55.
8. Wang JS, Zhang XD, Fang FZ, et al. (2019) Diamond cutting of micro-structure array on brittle material assisted by multi-ion implantation. Int J Mach Tool Manu 137: 58–66.
9. Wang JS, Zhang XD, Fang FZ (2016) Molecular dynamics study on nanometric cutting of ion implanted silicon. Comp Mater Sci 117: 240–250.
10. Fang FZ, Chen YH, Zhang XD, et al. (2011) Nanometric cutting of single crystal silicon surfaces modified by ion implantation. CIRP Ann 60: 527–530.
11. Wang M, Wang W, Lu Z (2012) Anisotropy of machined surfaces involved in the ultra-precision turning of single-crystal silicon-a simulation and experimental study. Int J Adv Manuf Tech 60: 473–485.
12. Cheung CF, To S, Lee WB (2002) Anisotropy of surface roughness in diamond turning of brittle single crystals. Mater Manuf Process 17: 251–267.
13. Kobaru Y, Kondo E, Iwamoto R (2012) Ultra-precision cutting of single crystal silicon using diamond tool with large top corner radius. Key Eng Mater 523: 81–86.
14. Kobaru Y, Kondo E, Iwamoto R (2017) Precision cutting of single crystal silicon using CBN tool with large top corner radius. Int J Nanomanuf 13: 170–184.
15. Abdulkadir LN, Abou-El-Hossein K, Jumare AI, et al. (2018) Ultra-precision diamond turning of optical silicon-a review. Int J Adv Manuf Tech 96: 173–208.
16. Zhang JJ, Han L, Zhang JG, et al. (2019) Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon. Int J Adv Manuf Tech. Available from: https://doi.org/10.1007/s00170-019-03888-8.

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