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AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635. Research article Topical Section

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Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon

1 Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China
2 Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China

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Topical Section: Materials Processing

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The machinability of brittle materials is strongly dependent on machining conditions. In the present work, we perform ultra-precision single point diamond turning experiments of monocrystalline Si(100) using diamond cutting tools. The machined surface quality is characterized by evaluating surface topography and surface integrity. Systematic investigation of cutting parameters dependence of machining results is performed by considering rake angle of cutting tool, depth of cut and spindle speed. Experimental results suggest an optimized combination of cutting parameters for the best surface quality of Si(100) by diamond turning.

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Keywords: monocrystalline silicon; diamond turning; surface integrity; rake angle

Citation: Lu Liao, Guo Li, Junjie Zhang. Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon. AIMS Materials Science, 2019, 6(5): 635-645. doi: 10.3934/matersci.2019.5.635

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