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Analysis of temperature dependent power supply voltage drop in graphene nanoribbon and Cu based power interconnects

1 School of VLSI Technology, Indian Institute of Engineering Science and Technology, Shibpur, India
2 Department of Electronics and Communication Engineering, Assam University, Silchar, India

Topical Section: 2D Materials

In this paper, we propose a temperature dependent resistive model of multi layered graphene nanoribbon (MLGNR) and Cu based power interconnects. Using the proposed model, power supply voltage drop (IR-drop) analysis for 16 nm technology node is performed. The novelty in our work is that this is the first time a temperature dependent IR-Drop model for MLGNR and Cu interconnects is proposed. For a temperature range from 150 K to 450 K, the variation of resistance of MLGNR interconnect is ~2–5× times lesser than that of traditional copper based power interconnects. Our analysis shows that MLGNR based power interconnects can achieve ~1.5–3.5× reduction in IR-drop and ~1.5–3× reduction in propagation delay as compared with copper based interconnects for local, intermediate and global interconnects.
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Keywords temperature; graphene nanoribbon (GNR); interconnects; power supply voltage drop (IR-drop); mean free path (MFP); international technology roadmap for semiconductors (ITRS)

Citation: Sandip Bhattacharya, Debaprasad Das, Hafizur Rahaman. Analysis of temperature dependent power supply voltage drop in graphene nanoribbon and Cu based power interconnects. AIMS Materials Science, 2016, 3(4): 1493-1506. doi: 10.3934/matersci.2016.4.1493


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This article has been cited by

  • 1. Sandip Bhattacharya, Debaprasad Das, Hafizur Rahaman, Analysis of Simultaneous Switching Noise and IR-Drop in Side-Contact Multilayer Graphene Nanoribbon Power Distribution Network, Journal of Circuits, Systems and Computers, 2017, 1850001, 10.1142/S0218126618500019
  • 2. Subhajit Das, Debaprasad Das, Hafizur Rahaman, Electro-thermal RF modeling and performance analysis of graphene nanoribbon interconnects, Journal of Computational Electronics, 2018, 10.1007/s10825-018-1245-2
  • 3. Sandip Bhattacharya, Subhajit Das, Arnab Mukhopadhyay, Debaprasad Das, Hafizur Rahaman, Analysis of a temperature-dependent delay optimization model for GNR interconnects using a wire sizing method, Journal of Computational Electronics, 2018, 10.1007/s10825-018-1251-4

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Copyright Info: 2016, Sandip Bhattacharya, et al., licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution Licese (http://creativecommons.org/licenses/by/4.0)

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