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Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jána Bottu č. 2781/25, 917 24 Trnava, Slovak Republic

The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measure the solders melting intervals and their thermal properties, the DSC analysis was realized. The measurement of wettability was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54°. Soldering alloy BiAg11 wets all substrates, wherein the best result (23°) was achieved on Ag substrate. Shear strength of BiAg11 and SnSb5 joints reached higher value then classic PbSn5 solder.
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© 2018 the Author(s), licensee AIMS Press. This is an open access article distributed under the terms of the Creative Commons Attribution Licese (http://creativecommons.org/licenses/by/4.0)

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